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Effect of Filling Ratio on Thermal Performance of Closed Loop Oscillating Heat Pipe

Author(s):

Sunilkumar D Vala , LDRP-ITR, GANDHINAGAR; Mr. K.K.Mehta; Dr. N.S.Mehta

Keywords:

Oscillating Heat, Pipe Base, Thermal Performance

Abstract

This paper justifies the effect of filling ratio on the closed loop oscillating heat pipe performance. An experimental investigation has been carried out on the thermal performance of the CLOHP with different filling ratio for water based CuO nanofluid. The thermal performance of the device has been investigated with varying heat power in the range of 30–150W in the vertical orientation. The overall thermal resistance and heat rejected by CLOHP are evaluated to predict the thermal performance of the device. Experimental results show that the CLPHPs filled with 30% filling ratio shows better performance for lower heat loads and 50% filling ratio shows better performance for higher heat loads. While the 70% filling ratio shows poor performance for all heat loads compared to 50% and 30%.

Other Details

Paper ID: IJSRDV4I20532
Published in: Volume : 4, Issue : 2
Publication Date: 01/05/2016
Page(s): 1006-1008

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