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A Review on Thermal Conductivity of Epoxy-Ceramic Composite

Author(s):

Chhabi Ram Sahu , GOVT. ENGG. COLLEGE, JAGDALPUR (C.G.); Dilbag Mondloe, GOVT. ENGG. COLLEGE, JAGDALPUR (C.G.); Ajay Singh Paikara, GOVT. ENGG. COLLEGE, JAGDALPUR (C.G.)

Keywords:

Thermal Conductivity (TC), Thermal Interface Material (TIM), Thermally Conductive Fillers, Epoxy Resin, Thermo-Gravimetric Analysis (TGA)

Abstract

Thermal management has become a serious problem with the development of electronics, where thermal interface material (TIM) is crucial for heat transfer from the device to heat sink. Addressing this challenge requires the development of new composite materials with enhanced thermal conductivity. Epoxy resin is one of that and it has been widely used in electrical and electronics industries due to its excellent adhesion and insulating properties. The past researches show that the internalization of filler materials of high thermal conductivity improves the thermal conductivity of epoxy composites, consequently improves the heat transfer in electronic devices. In this review paper the need of thermal interface material and epoxy as a thermal interface material are discussed.

Other Details

Paper ID: IJSRDV7I30162
Published in: Volume : 7, Issue : 3
Publication Date: 01/06/2019
Page(s): 146-152

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