Design and Simulation of Multilayer Microstrip to Stripline transition on LTCC for 20GHz frequency range application |
Author(s): |
| Rahulkumar Agrawal , Parul University, vadodara; PRIYANKA SHAH, PARUL UNIVERSITY, VADODARA; |
Keywords: |
| LTCC, Multilayer Ceramic Substrate, Microstrip To Stripline Transition |
Abstract |
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This paper shows design and simulation of multilayer ceramic technology that is used for the system in package (SiP) module packaging of different MMIC, MEMS and MOEMS and operates from d.c to 20 GHz frequency range. This paper describe about miniaturized Microstrip line to Stripline transition on to the layers of LTCC. This paper also describe about the proper utilization of vertical interconnection access (via) in Stripline design. The entire design of LTCC and the transmission line transition is simulated on High Frequency Simulated Structure (HFSS) software that is a 3-dimensional model EM simulator. The measured isolation and measured insertion loss is better than -0.045 dB at 12 GHz and -0.035 dB at 8 GHz. The return loss is better than -23 dB up to 12 GHz and -24.1 dB at 8 GHz. |
Other Details |
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Paper ID: NCACSETT1P022 Published in: Conference 10 : NCACSET 2017 Publication Date: 06/05/2017 Page(s): 1-3 |
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