FIN-SET ANALYSIS FOR HEAT REMOVAL UTILIZING ANSYS |
Author(s): |
| Yogendra Singh Tomar , SRCEM Gwalior; C. S. Kohli, SRCEM Gwalior |
Keywords: |
| Heat Removal, Fin-Set |
Abstract |
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Present paper discusses about heat transfer study of fin for electronics device cooling. All the electronic devices discharge heat during the work. That generated heat should be removed for proper working of the electronic device. Cooling of these heat generated devices can be done either by passive ways or active ways. Present paper emphasis on the passive (natural) ways which is fin to remove the discharge heat to the atmosphere. We assume that the electronic device is made of copper, fin is made of aluminium and the container which encloses the electronic device is made of steel. Convective conditions have been considered at the outer walls of the fin. Heat transfer coefficient of convection in the atmosphere has been considered around h=40 W/m2ºK and the ambient temperature is 27ºC. |
Other Details |
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Paper ID: IJSRDV3I110392 Published in: Volume : 3, Issue : 11 Publication Date: 01/02/2016 Page(s): 883-885 |
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