Analysis of Thermal Hydraulic Performance of Semicircular Pin Fin Heat Sink by using Computational Fluid Dynamics

The study was conducted by using the Computational Fluid Dynamics (CFD) method. The heat sinks are used with high power semiconductor devices such as power transistors, electronic devices lasers and light emitting diodes (LED’S). The major study was done on semicircular pin fin heat sink, a radii is taken as parameter. The heat transfer media was taken as an air & Aluminum (Al) as pin fin material. In our analysis, CFD was used and the model was developed on NX-5. In order to verify the present CFD model, the thermal resistance and the pressure drop are compared with the available experimental results present in the literature. And the design of semicircular Pin fin heat sink (SCPFHS) having radii is 0.5mm, 1.0mm and 1.0 mm. In this study, the simulations of SCPFHS at various wind velocity i.e., 6.5, 9.5, 12.5 & 15m/s and the configurations of pin-fins design are proposed. The results show that increasing wind velocity could reduce the thermal resistance and increase the pressure drop simultaneously.