Thermal Analysis on Different Shaped Heat Sink Profile

finned heat sinks are most widely used as a thermal solution to ensure the reliability of electronic devices with ever increasing power dissipation and circuit density. Among various types of heat sinks, plate-fin and pin-fin heat sinks are widely used owing to their own advantages. The plate-fin heat sink has the advantages of a small pressure drop, a simple design and an easy fabrication. On the other hand, the pin-fin heat sink has the advantages of a high heat transfer rate due to the redeveloping regions and an even thermal performance independent of the direction of the fluid flow. Recently, it has been found that the effective heat sink type between plate-fin and pin-fin heat sinks could be determined depending on the pumping power and heat sink length. In addition to above research activities, there has been a new attempt to combine the advantages of plate-fin and pin-fin heat sinks. Usually, these types of heat sinks have several cut and profile, perpendicular to the direction of the fluid flow. Main purpose of this work is to quantify effects of cross-cuts and profile. An experimental setup will be fabricated to study the pressure drop and heat transfer characteristics of the heat sinks. A comparison between the thermal performance of heat sink without cross-cut and another with single cross-cut.