Deposition and Characterization of Organosilicon Films Deposited by PECVD Method |
Author(s): |
| Baraiya Brijeshkumar Dhirubhai , Atmiya Institute of tecch. & science,Rajkot; Mr.Jayendra B.Kanani, Atmiya Institute of tecch. & science,Rajkot; Mrs.Purvi Kikani, FCIPT,IPR,Gandhinagar |
Keywords: |
| Plasma, Silicon oxide coating, Oxygen Transmission Rate, thickness |
Abstract |
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Polyethylene is widely used in packaging applications as it has very good mechanical and sealing properties. It is not used as single polymer due to its poor gas diffusion barrier properties. In the present work, plasma polymer coating has been deposited on polyethylene surface using Plasma Enhanced Chemical Vapour Deposition (PECVD) method. Coating experiments are being carried out using 13.56 MHz, Capacitive Coupled Radio Frequency glow discharge plasma. Base vacuum is created in the order of 10-5 mbar using Rotary – Diffusion pumping system. Films will be deposited at different RF powers. Plasma processed polyethylene surface will be characterized for surface chemistry by FT-IR spectroscopy, surface morphology by High Resolution Scanning Electron Microscopy (HR-SEM), film thickness by contact mode stylus Profilometer and for Oxygen Transmission Rate (OTR). |
Other Details |
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Paper ID: IJSRDV4I21407 Published in: Volume : 4, Issue : 2 Publication Date: 01/05/2016 Page(s): 1980-1982 |
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