Enhancement of Thermal Performance of Microchannel Heat Sink Used in Computer SMPS Fins by using CFD

In this research article various types of fin geometry were analyzed numerically to improve the heat transfer performance of microchannel heat sink of a computer SMPS fins. For numerical analysis a parallel plate fins portion of SMPS fins were taken with standard size. The geometry was modeled in Ansys fluent 14.0 and heat transfer rate evaluation were done with using steady state pressure based fluent solver. Some standard boundary and flow conditions were given for analysis. Then comparative analyses were done using square and circular pin fins. Aluminum, copper and nickel were used as materials. It was fond that replacing parallel plate fins with square and circular cross section fins with aluminum, copper and nickel material gives appreciable increase in thermal performance within appreciable volume of material. It was deduced that use of square and circular pin fins enhances heat transfer performance of heat sink.