Development and Wetting Behaviour of Traditional Sn-Pb Alloy |
Author(s): |
| Sagar Jindal , PEC UNIVERSITY OF TECHNOLOGY CHANDIGARH; Sachin Sharma, PEC University of Technology, Chandigarh |
Keywords: |
| Wettability, Contact Angle, Sn-37Pb |
Abstract |
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So far eutectic or near eutectic Sn-Pb alloys have been widely used in electronic industries due to their low melting temperature and good wettability. This study focused on development of Sn-37Pb alloy and also gives most attention to one of the most important property of solder alloy i.e. wetting behaviour or wettability. In this work wettability of solder alloy is examined on the basis of contact angle measurement. Moreover this work also finds Micro hardness of developed solder alloy using vicker's hardness testing machine and Microstructure of the alloy is investigated using Optical Microscope. Contact Angle of developed solder alloy is lies in the range of 15-18.5Ëš while the micro hardness of the alloy is reported in this study. |
Other Details |
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Paper ID: IJSRDV5I70126 Published in: Volume : 5, Issue : 7 Publication Date: 01/10/2017 Page(s): 161-164 |
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