Thermal Analysis of Zigzag Ply Heat Sink

Heat sinks are one of the most popular cooling systems. Also, they are one of the simplest devices for dissipating heat from components and electronic systems. The development of electronics is nowadays inextricably linked to the development of materials for heat sinks, heat sink design and production methods. Heat sinks can be produced by a number of methods depending on their use. Thermal resistance is the key parameter when deciding on the use of a radiator. A value of this parameter is affected by many factors, including surface area of a radiator, radiator shape, colour of the surface, air flow and heat sink temperature In this work, a new concept for cooling the electronic components using the copper-base zigzag ply heat sink is proposed. The thermal performance and temperature distribution for the heat sink were analyzed and a procedure for optimizing the geometrical design parameter is presented. A three-dimensional model is developed to investigate flow and conjugate heat transfer in the copper-base zigzag ply heat sink. The model was produced with the commercial program ANSYS. The theoretical model developed is validated by comparing the predictions of the model with available experimental data. Different types of cooling methods are analyzed to show the reliability and effectiveness in heat spreading of those. This report will also describe a modeling methodology that can be used to predict performance, with comparison to experimental.